BONDERITE^® S-FN 109B

BONDERITE^® S-FN 109B (also known as DAG 109B) is a dispersion of high-purity, fine-grain graphite dispersed in solvent and thermoplastic resin. The product dries rapidly, forming a highly flexible, high-adhesion conductive coating on most metals and plastics. The unique combination of adhesion and flexibility enhances the substrate's electrical performance by preventing cracks from forming in the cured coating. Additionally, the high-purity concentration of graphite creates an exceptionally effective conductive coating that finely controls the electrical properties on the substrate surface, making it well suited for electronic devices and components. For optimal performance, BONDERITE^® S-FN 109B should be applied using spray equipment or conventional printing techniques, resulting in controlled and evenly distributed film thickness across the surface. Applying the proper thickness and consistency is an important step in ensuring the performance and longevity of the coating, improving electrical conductivity and long-term protection of the underlying material.